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Inorganic Materials

, Volume 51, Issue 7, pp 673–678 | Cite as

Structure and mechanical properties of Ag–Cu films prepared by vacuum codeposition of Au and Cu

  • S. B. KushchevEmail author
  • M. A. Bosykh
  • S. V. Kannykin
  • A. V. Kostyuchenko
  • S. A. Soldatenko
  • M. S. Antonova
Article

Abstract

We have studied in detail the structure formation process in Ag–Cu films in the course of vacuum deposition of the metals, followed by thermal annealing, and compared the hardness values of nanocrystalline Ag, Cu, and Ag–Cu films. Under equivalent deposition conditions, the hardness of the Ag–Cu films produced by codeposition of the metals exceeds that of the Ag and Cu films. The high hardness of the mixedphase Ag–Cu films is due to their amorphous–nanocrystalline structure. We have determined the limiting grain size above which plastic deformation follows a dislocation mechanism.

Keywords

Nanocrystalline Structure Transmission Electron Micro Dislocation Mechanism Indent Depth Alloy Thin Film 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Pleiades Publishing, Ltd. 2015

Authors and Affiliations

  • S. B. Kushchev
    • 1
    Email author
  • M. A. Bosykh
    • 1
  • S. V. Kannykin
    • 2
  • A. V. Kostyuchenko
    • 1
  • S. A. Soldatenko
    • 1
  • M. S. Antonova
    • 1
  1. 1.Voronezh State Technical UniversityVoronezhRussia
  2. 2.Voronezh State UniversityVoronezhRussia

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