References
Blazej, D., “Thermal Interface Materials,” Electronic Cooling 9(4): 14–20 (2003).
Culham, R.J., Teertstra, P., Savija, I., and Yovanovich, M.M., “Design, Assembly and Commissioning of a Test Apparatus for Characterizing Thermal Interface Materials,” 8th Inter Society Conference on Thermal Phenomena, May 30–June 1: 128–135 (2002).
Liu, B.M., and Mui, Y.C., “TIM Characterization for High Performance Microprocessors,” 7th Electronics Packaging Technology Conference 1: 532–536 (2005).
Chiu, C.P., Chandran, B., Mello, M., and Kelley, K., “An Accelerated Reliability Test Method to Predict Thermal Grease Pump-Out in Flip-Chip Applications,” 51st Electronic Components and Technology Conference, May 29–June 1: 91–97 (2001).
JEDEC Standard 51-9, Integrated Circuit Thermal Test Method Environment Conditions —Natural Convection (Moving Air), Joint Electron Devices Engineering Council Standard (1995).
Solbrekken, G.L., and Chiu, C.P., “Calibration of Resistance Type Die Level Temperature Sensors Using a Single Temperature Technique,” IEEE Transactions on Components and Packaging Technologies 23(1): 40–46 (2000).
Montgomery, Design and Analysis of Experiments, 6th Edition, John Wiley & Sons, New York, NY (2007).
Dal, S.L.B., “Degradation Mechanism of Siloxane-based Thermal Interface Materials under Reliability Stress Conditions,” IEEE 42nd Annual International Reliability Physical Symposium, April 25–29: 537–542 (2004).
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Chen, C.I., Ni, C.Y., Pan, H.Y. et al. Practical evaluation for long-term stability of thermal interface material. Exp Tech 33, 28–32 (2009). https://doi.org/10.1111/j.1747-1567.2008.00343.x
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DOI: https://doi.org/10.1111/j.1747-1567.2008.00343.x