Skip to main content
SpringerLink
Log in

Experimental aided performance evaluation methods for wafer probe test

  • Techniques
  • Published:
Experimental Techniques Aims and scope Submit manuscript

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

References

  1. Kulicke & Soffa, “Introduction Blade Type Probe Card,” http://www.kns.com.

  2. Leung, J., “Overview of C4 Array Probing,” Proceedings of the IEEE SouthWest Test WorkShop, Session 2 (1999).

  3. JEM America Corp., “Introduction Vertical-Contact Probe Card,” http://www.jemam.com.

  4. Smith, K., “Membrane Cards with Microscrub Technology,” Proceedings of the IEEE SouthWest Test WorkShop, Session 3 (1999).

  5. Homorodi, T., and Martin, R., “High Parallelism Memory Test Advances Based on MicroSpring™ Contact Technology,” Proceedings of the IEEE SouthWest Test WorkShop, Session 6 (2001).

  6. Tracy, N.L., Rothenberger, R., Copper, C, Corman, N., Biddle, G., Matthews, A., and McCarthy, S., “Array Sockets and Connectors Using MicroSpring™ Technology,” Proceedings of the IEEE Electronic Manufacturing Technology Symposium, 129–140 (2000).

  7. NanoNexus Inc., “Introduction MEMS Probe Card,” http://www.nanonexus.com/.

  8. Maekawa, S., Takemoto, M., Kashiba, Y., Deguchi,Y., Miki, K., and Nagata, T., “Highly Reliable Probe Card for Wafer Testing,” Proceedings of the IEEE Electronic Manufacturing Technology Symposium, 1152–1156 (2000).

  9. Hotchkiss, G., Ryan, G., Subido, W., Broz, J., Mitchell, S., Rincon, R., Rolda, R., and Guimbaolibot, L., “Effect of Probe Damage on Wire Bond Integrity,” Proceedings of the IEEE Electronic Components and Technology Conference, 1175–1180 (2001).

  10. Broz, J.J., and Rincon, R.M., “Probe Contact Resistance Variations During Elevated Temperature Wafer Test, IEEE ITC International Test Conference (1999).

  11. Kulicke & Soffa, “Enhanced Standard Cantilever Epoxy Probe Cards,” http://www.kns.com.

Download references

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, National Chung Cheng University, Taiwan, Republic of China

    D. S. Liu, M. K. Shih & S. M. Liu

  2. ChipMOS Technologies Inc., Tainan, Republic of China

    T. Huang, Y. C. Chao & C. C. Yu

Authors
  1. D. S. Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. M. K. Shih
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. S. M. Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. T. Huang
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Y. C. Chao
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. C. C. Yu
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Liu, D.S., Shih, M.K., Liu, S.M. et al. Experimental aided performance evaluation methods for wafer probe test. Exp Tech 30, 23–27 (2006). https://doi.org/10.1111/j.1747-1567.2006.00081.x

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1111/j.1747-1567.2006.00081.x

Search

Navigation