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Residual stress measurement using the hole drilling method and laser speckle interferometry part IV: Measurement accuracy

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  • Technology Application Series
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References

  1. Steinzig, M., Hayman, G., and Prime, M. Verification of a Technique for Holographic Residual Stress Measurement, Proc. of the ASME Pressure Vessel and Piping Conf., Atlanta, GA, 2001. ASME PVP-429, pp. 65–70.

  2. Yerman, J.A., Kroenke, W.C., Long, W.H., Accuracy Evaluation of Residual Stress Measurements, Proc. of the 4th European Conf. on Residual Stresses, June 4–6, 1996.

  3. Steinzig, M., Ponchione, A. “Effect of Hole-Drilling Parameters on the Accuracy of Residual Stress Measurements for ESPI Hole Drilling” Proceedings of the BSSM International Conference on Advances in Experimental Mechanics, Stratford-Upon-Avon, UK, August 2002.

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Authors and Affiliations

  1. HYTEC, Inc., Los Alamos, NM, USA

    M. Steinzig (SEM Member, Vice President)

  2. HYTEC, Inc., University of British Columbia, Los Alamos, NM, USA

    T. Takahashi (student)

Authors
  1. M. Steinzig
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  2. T. Takahashi
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Additional information

ET occasionally features short Industry/ Application articles under the title, “Technology Applications.” The short articles demonstrate real world application of both measurement techniques and apparatus to be used primarily in industry and, in some cases, the classroom. This month we are continuing “Dynamic Strain Measurement Using Advanced 3D Photogrammetry.” Please contact Series Editor, Dr. Kristin B. Zimmerman, at kristin.b.zimmerman@gm.com, if you are interested in submitting a Technology Applications article.

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Steinzig, M., Takahashi, T. Residual stress measurement using the hole drilling method and laser speckle interferometry part IV: Measurement accuracy. Exp Tech 27, 59–63 (2003). https://doi.org/10.1111/j.1747-1567.2003.tb00141.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.2003.tb00141.x

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