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Gold wire and solder joint microforce testing using microforce tester

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References

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  5. Liu D.S., Chao Y.C., Wang C.H., Study of Wire Bonding Looping Formation in the Electronic Packaging Process Using the Three Dimensional Finite Element Method, Finite Element in Analysis and Design, accepted.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Chung Cheng University, Taiwan, R.O.C.

    Y. C. Chao Ph.D. Candidate & D. S. Liu (Associate Professor)

Authors
  1. Y. C. Chao Ph.D. Candidate
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  2. D. S. Liu
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Chao, Y.C., Liu, D.S. Gold wire and solder joint microforce testing using microforce tester. Exp Tech 27, 37–40 (2003). https://doi.org/10.1111/j.1747-1567.2003.tb00128.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.2003.tb00128.x

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