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Full-field dynamic displacement and strain measurement—Specific examples using advanced 3D image correlation photogrammetry: Part II

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References

  1. Cloud, Gary, Optical Methods of Engineering Analysis, Cambridge University Press, 1995.

  2. Williams, D.C, Ed., Optical Methods in Engineering Metrology, Chapman and Hall, 1993.

  3. Tyson, J., “Noncontact Full-field Strain Measurement with 3D ESPI,” Sensors, Vol. 17 No. 5, pp. 62–70, May 2000.

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  4. Mikhail, E., Bethel, J., and McGlone, J., Introduction to Modern Photogrammetry, John Wiley and Sons, 2001.

  5. Sonnichsen, H. Eric, Spin Testing, Gas Turbine News, Volume 37, Number 1, April 1997.

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Authors and Affiliations

  1. Trilion Quality Systems, W. Conshohocken, PA, USA

    T. Schmidt (SEM Member) & J. Tyson

  2. GOM mbH, Braunschweig, Germany

    K. Galanulis

Authors
  1. T. Schmidt
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  2. J. Tyson
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  3. K. Galanulis
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Additional information

ET occasionally features short Industry/Application articles under the title, “Technology Applications.” The short articles demonstrate real world application of both measurement techniques and apparatus to be used primarily in industry and, in some cases, the classroom. This month we are continuing two Technology Applications articles: 1) Dynamic Strain Measurement Using Advanced 3D Photogrammetry; and 2) Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry. Please contact Series Editor, Dr. Kristin B. Zimmerman, at kristin.b.zimmerman@gm.com, if you are interested in submitting a Technology Applications article.

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Schmidt, T., Tyson, J. & Galanulis, K. Full-field dynamic displacement and strain measurement—Specific examples using advanced 3D image correlation photogrammetry: Part II. Exp Tech 27, 22–26 (2003). https://doi.org/10.1111/j.1747-1567.2003.tb00118.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.2003.tb00118.x

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