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Residual stress measurement using the hole drilling method and laser speckle interferometry

Part II: Analysis technique

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  • Technology Application Series
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References

  1. Schajer, G.S., Measurement of Non-uniform Residual Stresses Using the Hole Drilling Method, J. Eng. Materials and Technology, 110 (4), Part I: pp. 338–343, Part II: pp. 345–349, 1988.

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  2. Lu, J., Ed. Handbook of Measurement of Residual Stresses, Society for Experimental Mechanics, The Fairmont Press, pp. 5–70, (1996)

  3. Prime, M.B., “Cross-sectional Mapping of Residual Stresses by Measuring the Surface Contour After a Cut,” Journal of Engineering Materials and Technology, Vol. 123, pp. 162–168, 2001.

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  4. Nelson, D.V., and McCrickerd, J.T., “Residual Stress Determination Through Combined Use of Holographic Interferometry and Blind Hole Drilling,” EXPERIMENTAL MECHANICS, 26 (4), 371–378 (1986).

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  5. Steinzig, M., Hayman, G., and Rangaswamy, P. “Data Reduction Method for Digital Holographic Residual Stress Measurement,” Proc. of SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 4–6, 2001, Portland, OR.

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Authors and Affiliations

  1. Los Alamos, NM, USA

    E. Ponslet (Director of Research) & M. Steinzig (SEM Member, Vice President, HYTEC, Inc.)

Authors
  1. E. Ponslet
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  2. M. Steinzig
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Additional information

ET occasionally features short Industry/ Application articles under the title, “Technology Applications.” The short articles demonstrate real world application of both measurement techniques and apparatus to be used primarily in industry and, in some cases, the classroom. This month we are continuing two Technology Applications articles: 1) Dynamic Strain Measurement Using Advanced 3D Photogrammetry; and 2) Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry. Please contact Series Editor, Dr. Kristin B. Zimmerman, at kristin.b.zimmerman@gm.com, if you are interested in submitting a Technology Applications article.

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Ponslet, E., Steinzig, M. Residual stress measurement using the hole drilling method and laser speckle interferometry. Exp Tech 27, 17–21 (2003). https://doi.org/10.1111/j.1747-1567.2003.tb00117.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.2003.tb00117.x

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