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Residual stress measurement using the hole drilling method and laser speckle interferometry: Part 1

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  • Technology Application Series
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References

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Authors and Affiliations

  1. Research, HYTEC, Inc., Los Alamos, NM., USA

    M. Steinzig (SEM Member is Vice President) & E. Ponslet (Director of Research, HYTEC, Inc.)

Authors
  1. M. Steinzig
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  2. E. Ponslet
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Additional information

ET occasionally features short Industry/ Application articles under the title, “Technology Applications.” The short articles demonstrate real world application of both measurement techniques and apparatus to be used primarily in industry and, in some cases, the classroom. This month we are featuring two Technology Applications articles: 1) Full-field Dynamic Displacement and Strain Measurement Using Advanced 3D Photogrammetry; and 2) Residual Stress Measurement Using the Hole Drilling Method and Laser Speckle Interferometry. Please contact Series Editor, Dr. Kristin B. Zimmerman, at kristin.b.zimmerman@gm.com, if you are interested in submitting a Technology Applications article.

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Steinzig, M., Ponslet, E. Residual stress measurement using the hole drilling method and laser speckle interferometry: Part 1. Exp Tech 27, 43–46 (2003). https://doi.org/10.1111/j.1747-1567.2003.tb00114.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.2003.tb00114.x

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