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Observing real-time thermal deformations in electronic packaging

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Summary

A robust scheme of moiré interferometry for real-time observation of thermal deformations was developed. It was implemented with a convection-type heating/cooling environmental chamber, which produced rapid temperature control. Vibrations caused by the environmental chamber were circumvented by rigid links that connected the specimen to the moiré interferometer rather than supporting the specimen by the chamber. The result was exceptionally stable fringes. The system was utilized to document temperature-dependent behavior of a PBGA package assembly.

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References

  1. Post, D., Han, B., and Ifju, P., High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials, Mechanical Engineering Series, Springer-Verlag, NY (1994).

    Book  Google Scholar 

  2. Han, B., Post, D., and Ifju, P., “Moiré; Interferometry for Engineering Mechanics: Current Practice and Future Development,” Journal of Strain Analysis, 36(1), pp. 101–117 (2001).

    Article  Google Scholar 

  3. Bastawros, A.F., and Voloshin, A.S., “Transient Thermal Strain Measurements in Electronic Packages,” IEEE Transactions on Components, Hybrids and Manufacturing Technology, 13(4), pp. 961–966 (1990).

    Article  Google Scholar 

  4. Bastawros, A.F., and Voloshin, A.S., “In Situ Calibration of Stress Chips,” IEEE Transactions on Components, Hybrids and Manufacturing Technology, 13(4), pp. 888–892 (1990).

    Article  Google Scholar 

  5. Bastawros, A.F., and Voloshin, A.S., “Thermal Strain Measurements in Electronic Packages through Fractional Fringe Moiré Interferometry,” Journal of Electronic Packaging, Transaction ofthe ASME, 112(4), pp. 303–308 (1990).

    Article  Google Scholar 

  6. Guo, Y., Chen, W.T., and Lim, C.K., “Experimental Determination of Thermal Strains in Semiconductor Packaging Using Moiré Interferometry,” Proceedings of 1992 Joint ASME/JSME Conference on Electronic Packaging, American Society of Mechanical Engineers, New York, pp. 779–784, 1992.

    Google Scholar 

  7. Guo, Y., Lim, C.K., Chen, W.T., and Woychik, C.G. “Solder Ball Connect (SBC) Assemblies under Thermal Loading: I. Deformation Measurement via Moiré Interferometry, and Its Interpretation,” IBM Journal of Research and Development, 37(5), pp. 635–648 (1993).

    Article  Google Scholar 

  8. Wu, T.Y., Guo, Y., and Chen, W.T. “Thermal-Mechanical Strain Characterization for Printed Wiring Boards,” IBM Journal of Research and Development, 37(5), pp. 621–634 (1993).

    Article  Google Scholar 

  9. Han, B., and Guo, Y., “Thermal Deformation Analysis of Various Electronic Packaging Products by Moire and Microscopic Moiré Interferometry,” Journal of Electronic Packaging, Transaction of the ASME, 117, pp. 185–191 (1995).

    Article  Google Scholar 

  10. Tsao, P.H., and Voloshin, A.S., “Manufacturing Stresses in the Die due to Die-Attach Process,” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18(1), pp. 201–205 (1995).

    Article  Google Scholar 

  11. Han, Y., Guo, Y., Lim, C.K., and Caletka, D., “Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods,” Journal of Electronic Packaging, Transaction of the ASME, 118, pp. 157–163 (1996).

    Article  Google Scholar 

  12. Han, B., and Guo, Y., “Determination of Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-field Approach,” IEEE Transactions on Components, Packaging and Manufacturing Technology-Part A, 19(2) pp. 240–247 (1996).

    Article  Google Scholar 

  13. Han, B. Chopra, Park, S., Li, L., and Verma, K., “Effect of Substrate CTE on Solder Ball Reliability of Flip-Chip PBGA Package Assembly,” Journal of Surface Mount Technology, 9, pp. 43–52 (1996).

    Google Scholar 

  14. Han, B., “Deformation Mechanism of Two-Phase Solder Column Interconnections under Highly Accelerated Thermal Cycling Condition: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, 119, pp. 189–196 (1997).

    Article  Google Scholar 

  15. Han, B., “Recent Advancement of Moiré and Microscopic Moire Interferometry for Thermal Deformation Analyses of Microelectronics Devices,” Experimental Mechanics, 38(4) pp. 278–288 (1998).

    Google Scholar 

  16. Zhao, J.-H., Dai, X., and Ho, P.S., “Analysis and Modeling Verification for Thermal-mechanical Deformation in Flip-Chip Packages,” Proceedings of 48th Electronic Components and Technology Conference, May 25–28, Seattle, WA, pp. 336–344, 1998.

  17. Voloshin, A.S., Tsao, P.H., and Pearson, R.A., “In situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive,” Journal of Electronic Packaging, Transaction of the ASME, 120(3), pp. 314–318 (1998).

    Article  Google Scholar 

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Authors and Affiliations

  1. Mechanical Engineering department, University of Maryland, College Park, MD, USA

    S. Cho (Graduate Student), S. Cho (Graduate Student) & B. Han (SEM Member, Associate Professor)

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  1. S. Cho
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Cho, S., Cho, S. & Han, B. Observing real-time thermal deformations in electronic packaging. Exp Tech 26, 25–29 (2002). https://doi.org/10.1111/j.1747-1567.2002.tb00065.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.2002.tb00065.x

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