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Residual stress evaluation by microscopic strain measurement

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References

  1. Rendler, N.J., Vigness, I., Hole-drilling strain-gauge method of measuring residual stresses. Experimental Mechanics 6 (1996), 577–586.

    Article  Google Scholar 

  2. Berka, L., Sova, M., Valach, J., Internal report ITAM CASci. Prague, December 1992.

  3. Kuhnert, R., Michel, B., Moiré techniques by means of scanning electron microscopy. Phys. State Solids (a) 89 (1985), 163–165.

    Article  Google Scholar 

  4. Sciammarella, C.A., Bhat, G., An electro-optical system to measure strains. Proc. of 9th Int. Conf. on Experimental Mechanics, TU Denmark, Copenhagen, 5 (1990), 1924–1933.

    Google Scholar 

  5. Davidson, D.L., The observation and measurement of displacements and strain by stereoimaging. Scanning Electron Microscopy (1979) 2, 79–86.

    Google Scholar 

  6. Berka, L., Ruzek, M., Analysis of microdeformations in a structure of polycrystals. J. Mater. Sci. 19 (1984) 5, 1486–1495.

    Article  Google Scholar 

  7. Allais, L., Bornert, M., Bretheau, T., Caldemaison, D., Experimental characterization of the local strain field in a heterogeneous elastoplastic material, Acta metall. mater. 42 (1994) 3865–3880.

    Article  Google Scholar 

  8. Crostack, H.-A., Fischer, G., Deformation measurement at microstructural level by means of object grating method within SEM. Proceedings of the 15th Riso International Symposium on Materials Science, 1994, 275–280.

  9. Berka, L., Ruzek, M., On micro-scale strain measurements using time based photogrammetry. Proc. of the 16th Congress of the Int. Soc. for Photogrammetry and Remote Sensing, Vol. 27, Part B9, p. V 141–151. Kyoto 1988.

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Berka, L., Sova, M. & Fischer, G. Residual stress evaluation by microscopic strain measurement. Exp Tech 22, 22–25 (1998). https://doi.org/10.1111/j.1747-1567.1998.tb01280.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.1998.tb01280.x

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