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Yield detection in aluminum welded joints using photostress

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Conclusions

  1. A)

    Photostress is very useful to provide a full field and point-by-point characterization of the behavior of welded joints having the weld beads on or ground off.

  2. B)

    Use of very thin coatings allows for measurement of strains in excess of 0.04.

  3. C)

    Poured PL-1 coatings 0.02 inches thick may be used successfully if extreme care in handling is exercised.

  4. D)

    PC-8 adhesive is quite satisfactory for measuring strains in excess of 0.04.

  5. E)

    Photostress is quite useful for detecting discontinuous yielding since the slip-hold-slip process produces instantaneous jumps in the fringe pattern.

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References

  1. Gambrell, S.C., Jr., “Use of Photostress to Characterize the Mechanical Behavior of Weldments,” Proceedings, VII Int. Congress on Experimental Mechanics, Las Vegas, NE, 543–549 (June 8–11, 1992).

  2. “Photostress Instrumentation,” Measurements Group, Inc. Literature, Raleigh, NC, Bulletin 315-B, (1989).

  3. “How to Select Photoelastic Coatings,” Measurements Group, Inc. Literature, Raleigh, NC, TN-704, (1978).

  4. “Automatic Data Acquisition,” ADA-1 through ADA-8, Measurements Group, Inc. Literature, Raleigh, NC.

  5. “Operating Instructions and Technical Manual-Strain Measurement with the 030-Series Reflection Polariscope,” Measurements Group, Inc. Literature, Raleigh, NC.

  6. “Instructions for Bonding Flat and Contoured Photoelastic Sheets to Test-Part Surfaces,” Measurements Group, Inc. Literature, Raleigh, NC, IB-223-F, (1982).

  7. “Instructions for Using PC-8 Adhesive,” Measurements Group, Inc. Literature, Raleigh, NC, 1B-231, (1982).

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Authors and Affiliations

  1. Engineering Mechanics Department, The University of Alabama, Tuscaloosa, AL, USA

    S. C. Gambrell Jr. (SEM Member, Professor of Engineering Mechanics) & K. Kavikondala (Graduate Research Assistant)

Authors
  1. S. C. Gambrell Jr.
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  2. K. Kavikondala
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Gambrell, S.C., Kavikondala, K. Yield detection in aluminum welded joints using photostress. Exp Tech 18, 11–14 (1994). https://doi.org/10.1111/j.1747-1567.1994.tb02378.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.1994.tb02378.x

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