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Material testing by computer aided speckle interferometry

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References

  1. Chiang, F.P., “Moiré Methods of Strain Analysis,” Chap. VI, Manual of Experimental Stress Analysis, 3rd ed., A.S. Kobayashi, Ed., Society for Experimental Mechanics, Inc., Bethel, CT (1978).

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  2. Post, D., “Moiré Interferometry,” Chap. 7, Handbook on Experimental Mechanics, A.S. Kobayashi, Ed., Prentice Hall, Englewood Cliffs, NJ (1987).

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  3. Chen, D.J. and Chiang, F.P., “Computer speckle interferometry,” Proc. of Int. Conf. on Hologram Interferometry and Speckle Metrology, 49–58 (1990).

  4. Chen D.J., Chiang F.P., Tan, Y.S. and Don K.S., “Computer Aided Speckle Interferometry (CASI): II. An Alternate Approach Using Spectral Amplitude and Phase Information,” Proc. SPIE, 1554A, 706–717 (1991).

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  5. Chen D.J., Li S., Hsu, T.Y. and Chiang, F.P., “Range of Measurement Computer Aided Speckle Interferometry,” Proc. SPIE, 1554A, 922–931 (1991).

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Authors and Affiliations

  1. Department of Mechanical Engineering, SUNY, Stony Brook, NY, USA

    Y. V. Wang (SEM Member, graduate student) & D. J. Chen (SEM Member, graduate student)

  2. Laboratory for Experimental Mechanics Research, SUNY, Stony Brook, NY, USA

    F. P. Chiang (SEM Fellow, Director)

Authors
  1. Y. V. Wang
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  2. D. J. Chen
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  3. F. P. Chiang
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Wang, Y.V., Chen, D.J. & Chiang, F.P. Material testing by computer aided speckle interferometry. Exp Tech 17, 30–32 (1993). https://doi.org/10.1111/j.1747-1567.1993.tb00772.x

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  • DOI: https://doi.org/10.1111/j.1747-1567.1993.tb00772.x

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