Contact design is a major challenge in the development of thermoelectric devices. New research shows that silver nanoparticles soldered at low temperature can sustain high service temperatures, improving the stability of devices operating across a wide range of temperatures and exploiting the maximum working temperature of thermoelectric materials.
References
He, R., Schierning, G. & Nielsch, K. Adv. Mater. Technol. 3, 1700256 (2018).
Yin, L. et al. Nat. Energy https://doi.org/10.1038/s41560-023-01245-4 (2023).
Sankhla, A., Kamila, H., Naithani, H., Mueller, E. & de Boor, J. Mater. Today Phys. 21, 100471 (2021).
Zheng, Y. et al. ACS Appl. Energy Mater 3, 2078–2089 (2020).
Lu, G. Q., Calata, J. N., Lei, G. & Chen, X. Low-temperature and pressureless sintering technology for high-performance and high-temperature interconnection of semiconductor devices. In Proc. 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, EuroSimE 2007 (IEEE, 2007).
Liu, R. et al. Nat. Commun. 13, 7738 (2022).
Tumminello, S., Ayachi, S., Fries, S. G., Müller, E. & de Boor, J. J. Mater. Chem. A 9, 20436–20452 (2021).
Ayachi, S. et al. Mater. Today Phys. 16, 100309 (2021).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Competing interests
The author declares no competing interests.
Rights and permissions
About this article
Cite this article
de Boor, J. Make contact with silver. Nat Energy 8, 647–648 (2023). https://doi.org/10.1038/s41560-023-01285-w
Published:
Issue Date:
DOI: https://doi.org/10.1038/s41560-023-01285-w
- Springer Nature Limited