Photolithography at a wavelength of 193 nm in the deep UV with water immersion lenses can now produce microelectronics containing features with a half-pitch as small as 40 nm. The big question is how much further can the technology be pushed?
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We gratefully acknowledge the cooperation of ASML and the help of Tilmann Heil and Markus Wiederspahn during the preparation of this manuscript.
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The authors of this piece are also employees of the company Carl Zeiss SMT, which is involved in the development of deep UV lithography.
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Totzeck, M., Ulrich, W., Göhnermeier, A. et al. Pushing deep ultraviolet lithography to its limits. Nature Photon 1, 629–631 (2007). https://doi.org/10.1038/nphoton.2007.218
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DOI: https://doi.org/10.1038/nphoton.2007.218
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