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Interconnects

Wiring electronics with light

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As data rates continue to spiral upwards, electrical interconnects based on copper traces and wires are struggling to keep up and optical solutions are looking increasingly attractive.

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Figure 1: The market adoption of communication technology (optical versus electrical) as a function of transmission distance.
Figure 2: Measured electrical-data rates as a function of distance for various material systems including standard FR4, Rogers and Flex.
Figure 3: Structure of the parallel VCSEL wavelength-division-multiplexed interconnect module developed by HP under the MAUI program.
Figure 4

References

  1. www.intel.com/go/sp

  2. Braunisch, H. et al. in IEEE Proc. 15th Top. Meeting Elec. Performance Elec. Packaging (EPEP) 273–276 (2006).

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  3. Colgan, E. et al. in IEEE Proc. 55th Electron. Comp. Tech. Conf. 228–233 (2005).

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Authors and Affiliations

  1. Photonics Technology Lab, Intel Corporation, 2200 Mission College Boulevard, Santa Clara, 95054, California, USA

    Andrew Alduino & Mario Paniccia

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  1. Andrew Alduino
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  2. Mario Paniccia
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Alduino, A., Paniccia, M. Wiring electronics with light. Nature Photon 1, 153–155 (2007). https://doi.org/10.1038/nphoton.2007.17

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