Abstract
IT has been reported1 that in a polycrystalline aggregate the properties of grain boundaries such as precipitation and chemical etching depend upon the difference in orientation of the adjoining grains. During our studies of cathodic sputtering of polycrystalline tin, we have observed differential etching from boundaries forming tricrystals2. Further work has shown that this differential etching can be correlated with the varying density of dislocation along the boundaries.
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DEO, P., SHARMA, B. Differential Sputtering of Grain Boundaries in Polycrystalline Tin. Nature 178, 812–813 (1956). https://doi.org/10.1038/178812a0
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DOI: https://doi.org/10.1038/178812a0
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