Abstract
The fundamental aspects of electroless nickel and copper plating of carbon fibers with the use of sodium hydroxymethane-sulfinate and thiourea dioxide as reducing agents were studied.
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RF Patent 2 063 461.
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Terskaya, I.N., Budanov, V.V., Makarov, S.V. et al. Electroless Nickel and Copper Plating of Carbon Fibers with the Use of Sulfur-containing Reducing Agents. Russian Journal of Applied Chemistry 77, 236–240 (2004). https://doi.org/10.1023/B:RJAC.0000030358.75384.dc
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DOI: https://doi.org/10.1023/B:RJAC.0000030358.75384.dc