Materials Science

, Volume 39, Issue 5, pp 672–681 | Cite as

Simulation of Thermomechanical Closure of an Initially Open Interface Crack with Heat Resistance

  • R. M. Martynyak
  • Kh. I. Honchar
  • S. P. Nahalka


We study the phenomenon of partial closure of an interface crack with heat resistance in a bimaterial with different thermal characteristics of the components subjected to the action of a tensile load and a heat flux perpendicular to the crack. The indicated phenomenon is observed if the heat flux is directed toward the material with lower thermal distortion and exceeds a certain threshold value. It is established that the region of contact of the crack lips formed in the middle of the crack and the contact pressure of the lips increase with the heat resistance of the crack. It is also shown that the stress intensity factor of normal interface stresses decreases if we neglect the effect of contact.


Heat Flux Stress Intensity Intensity Factor Stress Intensity Factor Contact Pressure 
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Copyright information

© Plenum Publishing Corporation 2003

Authors and Affiliations

  • R. M. Martynyak
    • 1
  • Kh. I. Honchar
    • 1
  • S. P. Nahalka
    • 1
  1. 1.Pidstryhach Institute for Applied Problems in Mechanics and MathematicsUkrainian Academy of SciencesLviv

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