Abstract
The eutectic alloy Sn–3.5 wt % Ag has been examined as one of the lead-free solder alloys. Microhardness tests as a function of temperature were performed to calculate the effective activation energy of the solder alloy Sn–Ag and compared with the pure elements Sn and Ag. Various creep parameters such as, exponent ntr and the parameter β in the transient creep stage and the values of the stress exponent n from the steady-state stage were calculated under different constant applied stresses at different working temperatures. The structure changes of the alloy were reported before and after creep test.
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El-Bahay, M.M., El Mossalamy, M.E., Mahdy, M. et al. Some mechanical properties of Sn–3.5 Ag eutectic alloy at different temperatures. Journal of Materials Science: Materials in Electronics 15, 519–526 (2004). https://doi.org/10.1023/B:JMSE.0000032586.62418.6c
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DOI: https://doi.org/10.1023/B:JMSE.0000032586.62418.6c