Abstract
Accurate and reproducible measurements of the Young’s modulus of solders are complicated by the early onset of yielding, microporosity, and variations in cooling rate. In this study, we report measurements of Young’s modulus of an Sn–3.5 wt % Ag solder by two techniques: (a) loading–unloading measurements in tension, and (b) non-destructive resonant ultrasound spectroscopy. Both techniques yielded similar values of Young’s modulus. The modulus decreased with increasing microporosity, in accordance with predicted values. Cooling rate affected the Ag3Sn intermetallic morphology, but not Young’s modulus since the distribution of the particles was relatively random. This result was confirmed by microstructure-based finite element modeling.
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Chawla, N., Ochoa, F., Ganesh, V.V. et al. Measurement and prediction of Young’s modulus of a Pb-free solder. Journal of Materials Science: Materials in Electronics 15, 385–388 (2004). https://doi.org/10.1023/B:JMSE.0000025683.19987.b3
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DOI: https://doi.org/10.1023/B:JMSE.0000025683.19987.b3