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Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tin–lead solder

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Abstract

Thermal cycling is used as a diagnostic test for electronic equipment. It is particularly severe on solder joints that are under both compressive and tensile strain during a cycle as a result of differential thermal expansion. The electronics industry document IPC-SM-785 addresses this problem and provides means whereby joint failure can be predicted as a function of the type and number of cycles used. The method can be applied to both non-compliant ceramic chips and compliant packages on FR4 board. This paper describes the applicability of SM-785 for both compliant and non-compliant packages. Due to the change in metallurgy of solder at temperatures approaching −20 °C, the approach is restricted to temperatures where near eutectic tin–lead solder is in its non-elastic form. A new approach will be needed when lead-free joining becomes mandatory.

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References

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Authors and Affiliations

  1. Middlesex University Microelectronics Centre, London, N11 2NQ, UK

    K. Pitt & G. Goldspink

Authors
  1. K. Pitt
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  2. G. Goldspink
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Pitt, K., Goldspink, G. Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tin–lead solder. Journal of Materials Science: Materials in Electronics 15, 261–264 (2004). https://doi.org/10.1023/B:JMSE.0000012465.06378.68

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  • DOI: https://doi.org/10.1023/B:JMSE.0000012465.06378.68

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