Abstract
Properties of body centered tetragonal tin are highly anisotropic. As a consequence large stresses can develop at the tin grain boundaries due to coefficient of thermal expansion mismatch during temperature excursions. A modeling approach to evaluate the 3D stress states that develop at grain boundaries during thermomechanical fatigue in tin-based solder is presented. Development of significant amounts of stresses in the plane of the grain boundary can cause grain-boundary sliding and surface-relief effects, while those normal to the grain boundary can cause grain-boundary decohesion and cracking.
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Subramanian, K.N., Lee, J.G. Effect of anisotropy of tin on thermomechanical behavior of solder joints. Journal of Materials Science: Materials in Electronics 15, 235–240 (2004). https://doi.org/10.1023/B:JMSE.0000012461.69417.75
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DOI: https://doi.org/10.1023/B:JMSE.0000012461.69417.75