Abstract
Structural, mechanical properties, and hardness indentation measurements of Sn65−x Ag25Sb10Cu x (x=0, 0.5, 1.0, 1.5, 2.0, and 2.5 wt %) solder alloys have been studied and analyzed. The alloy exhibits mechanical properties superior to those in both the Sn–Ag25 binary and Sn–Ag25Sb10 ternary solder alloys. The addition of small amounts of Cu is found to refine the effective grain size, while retaining the uniform distribution of Ag3Sn, SnSb, and Cu10Sn3 precipitates in the solidification microstructure, thus significantly improving the ductility and strength.
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R. M. Shalaby, Ph.D. Thesis, Mansoura University, Egypt (2001).
P. T. Vianco and D. R. Frear, J. Met. 45 (1993) 14.
M. Mccormack, S. Jin, G. W. Kammlott and H. S. Chen, Appl. Phys. Lett. 63 (1993) 15.
M. Mccormack and S. Jin, J. Met. 45 (1993) 36.
L. E. Felton, C. H. G. Readed and D. B. Knorr, ibid. 45 (1993) 28.
W. L. Winterbottom, ibid. 45 (1993) 20.
M. Kamal, A. M. Shaban, M. El-Kady and R. Shalaby, Second International Conference on Engineering Mathematics and Physics (ICEMP-94) Vol. 2, (1994) p. 107.
M. Kamal, A. M. Shaban, M. El-Kady and R. Shalaby, Radiat. Effects Defects Solids 138 (1996) 307.
R. Alarashi, A. M. Shaban and M. Kamal, Mater. Lett. 31 (1997) 61.
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Shalaby, R.M. Structural, mechanical, hardness indentation measurements of Sn65−x Ag25Sb10Cu x solder alloys rapidly solidified from melt at cooling rate 1.1×105 K s−1 . Journal of Materials Science: Materials in Electronics 15, 205–209 (2004). https://doi.org/10.1023/B:JMSE.0000012456.03140.6b
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DOI: https://doi.org/10.1023/B:JMSE.0000012456.03140.6b