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Study of wafer drying techniques for predeposition cleaning of silicon substrate surface

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References

  1. W. Kern, J. Electrochem. Soc. 137 (1990) 1890.

    Google Scholar 

  2. S. Watanabe, M. Nakayama and T. Ito, Appl. Phys. Lett. 59 (1991) 1458.

    Google Scholar 

  3. H. W. Kim, W. S. Hwang, C. Lee and R. Reif, J. Mater. Sci. Lett. 22 (2003) 939.

    Google Scholar 

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Authors and Affiliations

  1. School of Material Science and Engineering, Inha University, Yong Hyun Dong, Nam Gu, Incheon, 402-751, Korea

    Hyoun Woo Kim

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  1. Hyoun Woo Kim
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Correspondence to Hyoun Woo Kim.

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Kim, H.W. Study of wafer drying techniques for predeposition cleaning of silicon substrate surface. Journal of Materials Science 39, 4669–4670 (2004). https://doi.org/10.1023/B:JMSC.0000034167.10050.d2

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  • DOI: https://doi.org/10.1023/B:JMSC.0000034167.10050.d2

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