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Brazing Si3N4 ceramic using a Cu–Pd–Ti filler alloy for high-temperature applications

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Authors and Affiliations

  1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China

    J. Zhang, M. Naka & Y. Zhou

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  1. J. Zhang
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  2. M. Naka
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  3. Y. Zhou
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Zhang, J., Naka, M. & Zhou, Y. Brazing Si3N4 ceramic using a Cu–Pd–Ti filler alloy for high-temperature applications. Journal of Materials Science 39, 3159–3161 (2004). https://doi.org/10.1023/B:JMSC.0000025848.59254.90

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  • DOI: https://doi.org/10.1023/B:JMSC.0000025848.59254.90

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