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Measurement of yield strength of thin metal film

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Abstract

Based on measurement of the load-depth curve in nanoindentation, the yield strength of thin metal film on Si substrate can be determined with the model of finite element analysis. An example is given of thin Cu film and the result shows that the yield strength thus determined can eventually reflect changes of processing condition both in deposition and in post-treatment. The yield strength and its variation can be explained in terms of grain orientation and grain size.

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References

  1. D. T. Reed and F. W. Dally, J. Mater. Res. 8(7) (1993) 1542.

    Google Scholar 

  2. J. A. Ruud, D. Josell and F. Spacpen, ibid. 8(7) (1993) 122.

    Google Scholar 

  3. A. J. Griffin, Jr., F. R. Brotzen and C. F. Dunn, Script. Metall. 20(9) (1986) 1271.

    Google Scholar 

  4. Idem., Thin Solid Films. 150 (1987) 237.

    Google Scholar 

  5. G. Moulard, G. Contoux, G. Motyl, G. Gardet and M. Courbon, J. Vac. Sci. Technol. A 16(2) (1998) 736.

    Google Scholar 

  6. E. Weppelmann and M. V. Swain, Thin Solid Films. 286 (1996) 111.

    Google Scholar 

  7. P. A. Flinn, D. S. Gardner and W. D. Nix, J. Mater. IEEE Trans. Electron Devices. ED-34(3) (1987) 689.

    Google Scholar 

  8. M. D. Tran, J. Poublan and J. H. Dautzenberg, Thin Solid Films. 308/309 (1997) 310.

    Google Scholar 

  9. P. A. Flinn, J. Mater. Res. 6(7) (1991) 1498.

    Google Scholar 

  10. C. J. Shute and J. B. Cohen, ibid. 6(5) (1991) 950.

    Google Scholar 

  11. J. B. Pethica, R. Hutchings and W. C. Oliver, Phil. Mag. A 48 (1983) 593.

    Google Scholar 

  12. M. F. Doener and W. D. Nix, J. Mater. Res. 1 (1986) 601.

    Google Scholar 

  13. M. F. Doerner, D. S. Gardner and W. D. Nix, ibid. 1 (1986) 845.

    Google Scholar 

  14. W. C. Oliver and G. M. Pharr, ibid. 7 (1992) 1564.

    Google Scholar 

  15. D. J. Ma, K. W. Xu and J. W. He, Thin Solid Films. 323 (1998) 183.

    Google Scholar 

  16. S. Bader, E. M. Kalaugher and E. Artz, ibid. 263 (1995) 175.

    Google Scholar 

  17. C. J. Shut and J. B. Cohen, J. Mater. Res. 1 (1991) 950.

    Google Scholar 

  18. Z. H. Li, G. Y. Wu, Y. Gu, W. R. Chen and Y. Y. Wang, J. Vac. Sci. Technol. A 14 (1996) 2693.

    Google Scholar 

  19. P. A. Flinn, D. S. Gardner and W. D. Nix, J. Mater. IEEE Trans. Electron Devices. ED-34(3) (1987) 689.

    Google Scholar 

  20. J. M. Zhang and K. W. Xu, J. Ad. Mater. 34(1) (2002) 51.

    Google Scholar 

  21. R. Venkatraman and J. C. Bravman, J. Mater. Res. 7(8) (1992) 2040.

    Google Scholar 

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Authors and Affiliations

  1. State-Key Laboratory for Mechanical Behavior of Materials, Xian Jiaotong University, Xian, 710049, People's Republic of China

    Fei Wang & Kewei Xu

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  1. Fei Wang
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  2. Kewei Xu
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Correspondence to Kewei Xu.

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Wang, F., Xu, K. Measurement of yield strength of thin metal film. Journal of Materials Science 39, 3089–3094 (2004). https://doi.org/10.1023/B:JMSC.0000025837.75228.f4

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  • DOI: https://doi.org/10.1023/B:JMSC.0000025837.75228.f4

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