Abstract
To circumvent its present practical limits—mainly gate leakage and poor performance—‘MOSFET scaling’ has taken a different meaning: Not simply shrinking the device, but changing its nature. Here it is suggested that long-range Coulomb interactions constitute a possible fundamental cause of the poor performance of sub-50 nm devices. Alternative device-designs and materials are briefly discussed from a transport-physics perpsective: High-κ insulators, transport in thin Si body (SOI and double-gate), along different crystal directions and on different materials. The major role played by the interfaces (surface plasmons and phonons, roughness, confinement) emerges as one of the most important common elements.
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References
R.H. Dennard et al., IEEE J. Solid State Circuits, SC-9, 256 (1974).
H.S. Momose et al., Int. Electron Devices Meet., Tech. Dig.(IEEE, Piscataway, New Jersey, 1996), p. 105.
M.V. Fischetti and S.E. Laux, J. Appl. Phys., 89, 1205 (2001); M.V. Fischetti, J. Appl. Phys., 89, 1232 (2001).
K.G. Anil, S. Mahapatra, and I. Isele, Solid-State Electron., 47, 995 (2003).
T. Mizuno and R. Ohba, Int. Electron Devices Meet., Tech. Dig. (IEEE, Piscataway, New Jersey, 1996), p. 109.
G.A. Sai-Halasz et al., IEEE Electron Device Lett., EDL-9, 463 (1987).
A. Lochtefeld and D.A. Antoniadis, IEEE Electron Device Lett., 22, 95 (2001); D.A. Antoniadis, 2002 VLSI Symp. Tech. Dig. (IEEE, Piscataway, New Jersey, 2002), p. 2.
A. Chin et al., IEEE Electron Device Lett., 18, 417 (1997).
M. Krishnan et al., Int. Electron Dev. Meet. Tech. Dig. (IEEE, Piscataway, New Jersey, 1998), p. 571; Int. Electron Dev. Meet. Tech. Dig. (IEEE, Piscataway, New Jersey, 1999), p. 241.
N. Yang, W. Kirklen Henson, J.R. Hauser, and J.J. Wortman, IEEE Trans. Electron Devices, 47, 440 (2000).
G. Timp et al., Int. Electron Devices Meet. Tech. Dig. (IEEE, Piscataway, New Jersey, 1997), p. 930.
F. Lime, C. Guiducci, R. Clerc, G. Ghibaudo, C. Leroux, and T. Ernst, Solid-State Electron., 47, 1147 (2003).
S.Q. Wang and G.D. Mahan, Phys. Rev., B 6, 4517 (1972).
K. Hess and P. Vogl, Solid State Comm., 30, 807 (1979).
B.T. Moore and D.K. Ferry, J. Appl. Phys., 51, 2603 (1980).
M.V. Fischetti, D.A. Neumayer, and E.A. Cartier, J. Appl. Phys., 90, 4587 (2001).
J. Welser, J.L. Hoyt, S. Takagi, and J.F. Gibbons, Int. Electron Devices Meet., Tech. Dig. (IEEE, Piscataway, New Jersey, 1994), p. 373.
S. Takagi, J.L. Hoyt, J.J. Welser, and J.F. Gibbons, J. Appl. Phys., 80, 1567 (1996).
K. Rim, J.L. Hoyt, and J.F. Gibbons, Int. Electron Devices Meet., Tech. Dig. (IEEE, Piscataway, New Jersey, 1998), p. 707.
N. Sugii, K. Nakagawa, S. Yamaguchi, and M. Miyao, Appl. Phys. Lett., 75, 2948 (1999).
T. Mizuno, N. Sugiyama, H. Satake, and S. Takagi, 2000 Symposium on VLSI Tech. Dig. (IEEE, Piscataway, New Jersey, 2000), p. 210.
K. Rim, J.L. Hoyt, and J.F. Gibbons, IEEE Trans. Electron Devices, 47, 1406 (2000).
K. Rim et al., 2002 Symposium on VLSI Tech. Dig. (IEEE, Piscataway, New Jersey, 2002), p. 98.
Hasan M. Nayfeh et al., 60th Dev. Res. Conf. Dig. (IEEE, Piscataway, New Jersey, 2002), p. 43.
M.V. Fischetti, F. Gámiz, and W. Hänsch, J. Appl. Phys., 92, 7320 (2002).
Y.H. Xie et al., Phys. Rev. Lett., 73, 3006 (1994).
F. Gámiz et al., J. Appl. Phys., 86, 6854 (1999).
F. Gámiz and M.V. Fischetti, J. Appl. Phys., 89, 5478 (2001).
K. Uchida et al., International Electron Device Meeting Tech. Digest (IEEE, Piscataway, New Jersey, 2002), p. 47.
H. Iwata, J. Appl. Phys., 90, 866 (2001).
D. Esseni et al., IEEE Trans. Electron Devices, 48, 2842 (2001).
Z. Ren et al., International Electron Device Meeting Tech. Digest (IEEE, Piscataway, New Jersey, 2002), p. 51.
M.V. Fischetti, Z. Ren, P.M. Solomon, M. Yang, and K. Rim, J. Appl. Phys. (to appear, Aug. 1, 2003).
F. Gámiz et al., J. Appl. Phys., 89, 1764 (2001).
T. Ando, J. Phys. Soc. Japan, 43, 1616 (1977); T. Ando, A.B. Fowler, and F. Stern, Rev. Mod. Phys., 54, 437 (1982).
C.-Y. Mou and T.-M. Hong, Phys. Rev., B 61, 12612 (2000).
R.E. Prange and T.-W. Nee, Phys. Rev., 168, 779 (1968).
A. Gold, Solid State Commun., 60, 531 (1986); Phys. Rev., B 35, 723 (1987).
H. Sakaki et al., Appl. Phys. Lett., 51, 1934 (1987).
D.R. Leadley et al., Semicond. Sci. Technol., 17, 708 (2002).
M.V. Fischetti and S.E. Laux, J. Appl. Phys., 80, 2234 (1996).
M. Yang et al., submitted to IEEE Electron. Device Lett. (2002).
M. Lundstrom, IEEE Electron Device Lett., 18, 361 (1997).
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Fischetti, M. Scaling MOSFETs to the Limit: A Physicists's Perspective. Journal of Computational Electronics 2, 73–79 (2003). https://doi.org/10.1023/B:JCEL.0000011402.54036.32
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DOI: https://doi.org/10.1023/B:JCEL.0000011402.54036.32