Journal of Applied Electrochemistry

, Volume 34, Issue 8, pp 857–866 | Cite as

Development of an Electrodeposited Nanomold from Compositionally Modulated Alloys

  • Che-Yih Lim
  • Q. Huang
  • X. Xie
  • A. Safir
  • S.A. Harfenist
  • R. Cohn
  • E.J. Podlaha


Electrodeposited multilayers of NiCu/Cu and NiFeCu/Cu were examined for nanoimprinting applications. Layer sizes on the order of 100 nm were deposited and the copper layer etched. Current efficiency and layer composition of electrolytes having different pH values were examined utilizing a rotating disk electrode. Due to large grain growth in the NiCu/Cu system, the bilayers resulted in a macroscopic waviness of the layers. Adding Fe in a small concentration successfully produced straight layers. As an example of the replication technique, the metal multilayer-etched stamp was used to cast the multilayer image in rubber and emboss it in Teflon®.

electrodeposition multilayers NiCu/Cu NiFeCu/Cu nanoimprinting 


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Copyright information

© Kluwer Academic Publishers 2004

Authors and Affiliations

  • Che-Yih Lim
    • 1
  • Q. Huang
    • 1
  • X. Xie
    • 2
  • A. Safir
    • 3
  • S.A. Harfenist
    • 2
  • R. Cohn
    • 3
  • E.J. Podlaha
    • 1
  1. 1.Gordon and Mary Cain Department of Chemical EngineeringLouisiana State UniversityBaton RougeUSA
  2. 2.Geology DepartmentLouisiana State UniversityBaton RougeUSA
  3. 3.ElectroOptics Research InstituteUniversity of LouisvilleLouisvilleUSA

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