Development of an Electrodeposited Nanomold from Compositionally Modulated Alloys
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Electrodeposited multilayers of NiCu/Cu and NiFeCu/Cu were examined for nanoimprinting applications. Layer sizes on the order of 100 nm were deposited and the copper layer etched. Current efficiency and layer composition of electrolytes having different pH values were examined utilizing a rotating disk electrode. Due to large grain growth in the NiCu/Cu system, the bilayers resulted in a macroscopic waviness of the layers. Adding Fe in a small concentration successfully produced straight layers. As an example of the replication technique, the metal multilayer-etched stamp was used to cast the multilayer image in rubber and emboss it in Teflon®.
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