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Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source

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Abstract

The interaction between internal defects and an interface crack in a bimaterial subjected to a thermal load, in particular a heat source, is examined. Attention is focused on the construction of the associated integral equations.

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Authors and Affiliations

  1. Voronezh State University of Architecture and Civil Engineering, ul. 20-letija Oktjabrja 84, 394006, Voronezh, Russia

    Vera E. Petrova

  2. Paderborn University, LTM, Pohlweg 47-49, D-33098, Paderborn, Germany

    Klaus P. Herrmann

Authors
  1. Vera E. Petrova
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  2. Klaus P. Herrmann
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Petrova, V.E., Herrmann, K.P. Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source. International Journal of Fracture 128, 49–63 (2004). https://doi.org/10.1023/B:FRAC.0000040967.13962.ec

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  • DOI: https://doi.org/10.1023/B:FRAC.0000040967.13962.ec

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