Abstract
The size effects on fracture behavior of Cu foil are investigated by a new optical technique, the digital speckle correlation method (DSCM). Displacement and strain fields around a crack tip are analyzed for different thicknesses of Cu foil. Then, the J integral and fracture toughness J C are evaluated directly from the strain fields around the crack tip. The fracture toughness J C is obtained as a function of foil thickness. The results indicate that J C indeed depends on foil thickness within a certain range of thickness (the thickness varies from 20 micron to 1 millimeter in this work).
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Wang, HW., Kang, YL., Zhang, ZF. et al. Size effect on the fracture toughness of metallic foil. International Journal of Fracture 123, 177–185 (2003). https://doi.org/10.1023/B:FRAC.0000007376.06477.e8
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DOI: https://doi.org/10.1023/B:FRAC.0000007376.06477.e8