Abstract
First, the near-tip stress and electric displacement fields are analytically solved for a dynamically propagating interfacial crack in a piezoelectric bimaterial. Second, from the rate formulation of the energy balance in a piezoelectric material, the path independent dynamic J integral is derived, which has the physical significance of the energy release rate. Using the present near-tip analytical solutions, the relationships between the dynamic J integral and the stress and electric displacement intensity factors are also obtained. It is shown that the path independent dynamic J integral contains the static J integral and the dynamic J integral for elastic materials, and static J integral for piezoelectric materials as special cases. Third, for an interfacial crack in a piezoelectric bimaterial, the path independent separated dynamic J integrals are derived, which have the physical significance of energy flow rates into the propagating interfacial crack tip from the individual material sides or, equivalently, the separated dynamic energy release rates. Fourth, to accurately evaluate mixed-mode stress and electric displacement intensity factors, the component separation method of the dynamic J integral is developed. Finally, the finite element analyses of a static stationary interfacial crack in a piezoelectric bimaterial subject to mechanical, electrical and combined loading are carried out to demonstrate the applicability of the generalized (dynamic) J integral and the separated J integral, and the component separation method.
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Nishioka, T., Shen, S. & Yu, J. Dynamic J integral, separated dynamic J integral and component separation method for dynamic interfacial cracks in piezoelectric bimaterials. International Journal of Fracture 122, 101–130 (2003). https://doi.org/10.1023/B:FRAC.0000005768.61301.a7
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DOI: https://doi.org/10.1023/B:FRAC.0000005768.61301.a7