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Surface Passivation Technique for Selective Hole Filling by Chemical Vapor Deposition

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Journal of Materials Science Letters

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References

  1. M. J. Hampden-smith and T. T. Kodas, Chem. Vap. Deposition 1 (1995) 8.

    Google Scholar 

  2. A. Hasper, J. Holleman, J. Middelhoek, C. R. Kleijn and C. J. Hoogendoorn, J. Electrochem. Soc. 138 (1991) 1728.

    Google Scholar 

  3. X. Li, B.-Y. Kim and S. Rhee, Appl. Phys. Lett. 67 (1995) 3426.

    Google Scholar 

  4. B.-Y. Kim, X. Li and S. Rhee, ibid. 68 (1996) 3567.

    Google Scholar 

  5. K. Sugai, H. Okabayashi, T. Shinzawa, S. Kishida, A. Kobayashi, T. Yako and H. Kadokura, J. Vac. Sci. Technol. B 13 (1995) 2115.

    Google Scholar 

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Surface Passivation Technique for Selective Hole Filling by Chemical Vapor Deposition. Journal of Materials Science Letters 17, 947–949 (1998). https://doi.org/10.1023/A:1026464623138

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  • DOI: https://doi.org/10.1023/A:1026464623138

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