Abstract
Quasi-steady state hydrodynamic voltammetry at a rotating-disc electrode and electrochemical impedance spectroscopy were used to investigate the influence of triethyl-benzyl-ammonium (TEBA) chloride on the kinetics of copper electrodeposition from sulphate acidic electrolytes. SEM and X-ray diffraction analysis were used to examine the morphology and the structure of copper deposits. The kinetic parameters (i 0, α c, k 0), obtained by both Tafel and Koutecky–Levich interpretations lead to the conclusion that TEBA acts as an inhibitor of copper electrodeposition process, as a consequence of its adsorption on the electrode surface. The influence of TEBA on the kinetics of copper electrodeposition was explained in terms of a reaction model confirmed by the simulated impedance spectra. TEBA acts only as a blocking agent competing for adsorption active sites of the cathodic surface with cuprous ions without changing the reaction pathway corresponding to the absence of the additive.
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Varvara, S., Muresan, L., Popescu, I. et al. Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride. Journal of Applied Electrochemistry 33, 685–692 (2003). https://doi.org/10.1023/A:1025069004355
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DOI: https://doi.org/10.1023/A:1025069004355