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Interaction between Elements in Electroplated Copper-Based Alloys: An Inversion Voltammetry Study

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Abstract

Electroplated copper alloys containing Zn, Cd, Sn, and Pb belong with binary systems characterized by strong interactions between components. The degree of interaction between components in the deposit decreases in the sequence Cu–Sn > Cu–Cd > Cu–Zn > Cu–Pb.

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References

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Authors and Affiliations

  1. Tyumen State University of Oil and Gas, ul. Volodarskogo 38, Tyumen, 625000, Russia

    V. V. Povetkin, M. S. Zakharov, T. E. Ivanova & A. V. Muslimova

Authors
  1. V. V. Povetkin
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  2. M. S. Zakharov
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  3. T. E. Ivanova
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  4. A. V. Muslimova
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Povetkin, V.V., Zakharov, M.S., Ivanova, T.E. et al. Interaction between Elements in Electroplated Copper-Based Alloys: An Inversion Voltammetry Study. Russian Journal of Electrochemistry 39, 820–822 (2003). https://doi.org/10.1023/A:1024850724362

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  • DOI: https://doi.org/10.1023/A:1024850724362

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