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Electrochemical reliability of plasma-polymerized cyclohexane films deposited on copper in microelectronic devices

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Department of Advanced Materials Engineering, SungKyunKwan University, 300 ChunChun-Dong, Jangan-Gu, Suwon, 440-746, South Korea

    Z.-T. Park, Y.-S. Choi & J.-G. Kim

  2. Department of Chemistry, SungKyunKwan University, 300 ChunChun-Dong, Jangan-Gu, Suwon, 440-746, South Korea

    J.-H. Boo

Authors
  1. Z.-T. Park
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  2. Y.-S. Choi
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  3. J.-G. Kim
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  4. J.-H. Boo
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Park, ZT., Choi, YS., Kim, JG. et al. Electrochemical reliability of plasma-polymerized cyclohexane films deposited on copper in microelectronic devices. Journal of Materials Science Letters 22, 945–947 (2003). https://doi.org/10.1023/A:1024679906737

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