Skip to main content
Log in

Thermal behaviour of urea-formaldehyde resins during curing

  • Published:
Journal of Thermal Analysis and Calorimetry Aims and scope Submit manuscript

Abstract

Urea-formaldehyde (UF) resins are the most widely used polycondensation resins today in manufacturing particleboards. The performance of UF resins in their processing is greatly influenced by curing characteristics. The cure process has been monitored by TG-DTA technique on a Setaram labsysTM instrument in dynamic heating conditions at different heating rates. Commercial UF resins from different suppliers used in Estonian particleboard factories were selected for TG-DTA measurements. Experiments were carried out without and with catalysts. Ammonium chloride and ammonium sulphate were used. Curing characteristics were evaluated both for fresh and aged resins.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. S. Zeman and L. A. Tokárová, Thermochim. Acta, 202 (1992) 181.

    Article  CAS  Google Scholar 

  2. S. Chow and P. R. Steiner, Holzforschung, 29 (1975) 4.

    Article  CAS  Google Scholar 

  3. G. E. Myers and J. A. Koutsky, Holzforschung, 44 (1990) 117.

    Article  CAS  Google Scholar 

  4. M. Szesztay, Z. László-Hedvig, E. Kovacsovics and F. Tüdős, Holz Roh Werkst., 51 (1993) 297.

    Article  CAS  Google Scholar 

  5. A. Pizzi and L. A. Panamgama, J. Appl. Polym. Sci., 58 (1995) 109.

    Article  CAS  Google Scholar 

  6. R. O. Ebewele, J. Appl. Polym. Sci., 58 (1995) 1689.

    Article  CAS  Google Scholar 

  7. K. Umemura, S. Kawai, R. Ueno, Y. Mizuno and H. Sasaki, Mokuzai Gakkaishi, 42 (1996) 489.

    CAS  Google Scholar 

  8. K. Umemura, S. Kawai, H. Sasaki, R. Hamada and Y. Mizuno, J. Adhesion, 59 (1996) 87.

    Article  CAS  Google Scholar 

  9. A. Pizzi, J. Appl. Polym. Sci., 63 (1997) 603.

    Article  CAS  Google Scholar 

  10. M. Dunky, Intern. J. Adhes. & Adhes., 18 (1995) 95.

    Article  Google Scholar 

  11. S.-I. Tohmura, C.-Y. Hse and M. Higuchi, Int. Contrib. Wood Adhes. Res., Meeting Date 1998, (1999) 93.

  12. P. Christjanson, K. Siimer, T. Pehk and I. Lasn, Holz Roh Werkst., accepted.

  13. K. Siimer, T. Pehk and P. Christjanson, Macromol. Symp., 148 (1999) 149.

    Article  CAS  Google Scholar 

  14. M. G. Kim, H. Wan, B. Y. No and W. L. Nieh, J. Appl. Polym. Sci., 82 (2001) 1155.

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Siimer, K., Kaljuvee, T. & Christjanson, P. Thermal behaviour of urea-formaldehyde resins during curing. Journal of Thermal Analysis and Calorimetry 72, 607–617 (2003). https://doi.org/10.1023/A:1024590019244

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1023/A:1024590019244

Navigation