Abstract
Being added to electroless plating baths, organic compounds with –S–S– fragments are shown to inhibit the bulk reaction and exert the catalytic effect on the surface reaction in a certain concentration range. An introduction of an NH2 group promotes the inhibition effect and reduces the catalytic action due to the formation of complexes which results in a decrease in the polarizing ability of sulfur atoms and the formation of the less active surface. A correlation between the electroless plating parameters and the anodic oxidation rate of hypophosphite is revealed.
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Sotskaya, N.V., Ryabinina, E.I., Kravchenko, T.A. et al. Kinetics of Electroless Plating of Ni–P Alloys with Organic Additives Containing –S–S-Fragments. Protection of Metals 39, 250–254 (2003). https://doi.org/10.1023/A:1023967120687
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DOI: https://doi.org/10.1023/A:1023967120687