Abstract
Organic additives to electroless plating baths are shown to affect the surface reaction by changing the catalytic activity of the surface. The presence of a thioketone group in the additive increases the surface activity, which results in acceleration of the target reaction. The presence of the iminogroup favors the formation of complexes and alters the rates of concurrent reactions, which weakens the surface activity. The reaction in the volume is governed by the inhibiting properties of additives dependent on the identity of functional groups. The greater the electron-donor properties of the additive, the higher their adsorbability and the stronger the blocking effect, which stabilizes the electrolyte.
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REFERENCES
Gorbunova, K.M. and Nikiforova, A.A., Fizikokhimicheskie osnovy protsessa khimicheskogo nikelirovaniya (Physico-chemical Fundamentals of Electroless Nickel Plating), Moscow: AN SSSR, 1960.
Bielinski, I., Metalloberfläche, 1984, vol. 38, p. 20.
Gyanutene, I. and Lyankaitene, Yu.,Zashch. Met., 1996, vol. 32. no. 6, p. 648.
Keping, H. and Fang, J.L., Metal Finish., 1997, vol. 95, p. 73.
Ryabinina, E.I., Sotskaya, N.V., Kravchenko, T.A., and Shikhaliev, Kh.S., Zh. Prikl. Khim., 1999, vol. 72, no. 11, p. 1822.
Sotskaya, N.V., Sleptsova, O.V., Sadov, S.V., and Kravchenko, T.A., Zh. Prikl. Khim., 1993, vol. 66, no. 7, p. 1639.
Sadakov, G.A. and Gorbunova K.M., Elektrokhimiya, 1980, vol. 16, no. 3, p. 230.
Lyaukonis, Yu.Yu. and Yusis, Z.Z., Issledovaniya v oblasti ocazhdeniya metallov (Studies in the Metal Deposition Field), Vilnius: Institute of Chemistry and Chemical Technology, Lithuanian Academy of Sciences, 1983, p. 307.
Khaldeev, G.V., Petukhov, I.V., and Shcherban', M.G., Elektrokhimiya, 2000, vol. 36, no. 9, p. 1062.
Petukhov, I.V., Shcherban', M.G., and Kichigin, V.I., Zashch. Met., 1999, vol. 35, no. 1, p. 92.
Gromyko, V.A., Tsygankova, T.B., Gaidadymov, V.B., et al., Elektrokhimiya, 1973, vol. 9, no. 11, p. 1685.
Gorbunova, K.M., Nikiforova, A.A., and Sadakov, G.A., Itogi Nauk. Tekh., Ser. Elektrokhimiya, Moscow: VINITI, 1968, p. 5.
Sallo, J.S., Kivel, J., and Albers, F.S., J. Electrochem. Soc., 1963, vol. 110, p. 40.
Polukarov, Yu.M., Semenova, Z.V., and Moiseev, V.P., Elektrokhimiya, 1976, vol. 12, no. 7, p. 1157.
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Sotskaya, N.V., Ryabinina, E.I., Kravchenko, T.A. et al. The Role of Organic Additives in the Electroless Nickel Plating Bath. Protection of Metals 39, 245–249 (2003). https://doi.org/10.1023/A:1023915103849
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DOI: https://doi.org/10.1023/A:1023915103849