References
G. T. Kohman, H. W. Hermance and G. H. Downes, Bell System Technical Journal 34 (1955) 1115.
T. Tsukui and Y. Yokosuka, Electronic Circuit and Packaging Technology 9 (1994) 190. (In Japanese).
T. Tsukui, S. Yoshihara and K. Tanabe, in Proceedings of MES2001, Osaka (JIEP, Tokyo, 2001) p. 15. (In Japanese).
M. J. Ditz, in Proceedings of 20th ISTFA (1994) p. 181.
T. A. Witten and L. M. Sander, Phys. Rev. Lett. 53 (1984) 286.
H. Eyring, in “The Theory of Rate Processes: The Kinetics of Chemical Reactions, Viscosity, Diffusion and Electrochemical Phenomena” (McGraw-Hill, New York, 1941).
H. Adachi and I. Tanaka, in “Ryoushi Zairyougaku no Syoho” (Sankyou Shuppan, Tokyo, 1998) p. 148. (In Japanese).
H. Adachi, M. Tsukada and C. Satoko, J. Phys. Soc. Jpn. 45 (1978) 875.
H. Ohtaki and T. Radnai, Chem. Rev. 93 (1993) 1157.
R. S. Mulliken, J. Chem. Phys. 23 (1955) 1841.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Inoue, M. Origin of the ion migration tendency for several metals in electronics packaging systems. Journal of Materials Science Letters 22, 607–609 (2003). https://doi.org/10.1023/A:1023354630638
Issue Date:
DOI: https://doi.org/10.1023/A:1023354630638