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Application of bond order in solid solution strengthening of nickel

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Structures, Materials and Propulsion Laboratory, Institute for Aerospace Research, National Research Council Canada, Ottawa, Canada

    K. Chen & L. R. Zhao

  2. National Research Council Canada, Steacie Institute for Molecular Science, Ottawa, Canada

    John S. Tse

Authors
  1. K. Chen
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  2. L. R. Zhao
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  3. John S. Tse
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Chen, K., Zhao, L.R. & Tse, J.S. Application of bond order in solid solution strengthening of nickel. Journal of Materials Science Letters 22, 603–605 (2003). https://doi.org/10.1023/A:1023302613800

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