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Microstructure dependence of steady state creep in Cd–Sn eutectic alloy

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Czechoslovak Journal of Physics Aims and scope

Abstract

The steady state creep of Sn–33 wt.% Cd alloy was studied under various constant stresses ranging from 25.56 to 30.85 MPa in the temperature range from 353 to 433 K. The stress exponent n was found to change from 6.25 to 4.55 in the above temperature range. The energy activating the steady state creep amounted to 59.3kJ/mol in the temperature range from 353 K to 393 K and to 37 kJ/mol in the temperature range from 413 K to 433 K characterizing the grain boundary diffusion in Cd and in Sn, respectively. Microstructure analysis confirmed that the above mentioned mechanisms took place during steady state creep.

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  1. M. M. Mostafa

    Present address: Teachers College of Madinah, P.O.Box 1343, Al-Madinah Al-munawara, Kingdom of Saudi Arabia

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  1. Physics Department, Faculty of Education, Ain Shams University, Heliopolis, Cairo, Egypt

    M. M. Mostafa

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Mostafa, M.M. Microstructure dependence of steady state creep in Cd–Sn eutectic alloy. Czechoslovak Journal of Physics 50, 1051–1057 (2000). https://doi.org/10.1023/A:1022883403097

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