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An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths Part II: Overall system

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Abstract

An electrochemical system for oxidative removal of high levels of total organic carbon (TOC) in printed circuit board (PCB) copper sulfate plating baths has been developed. These organic contaminants build-up over the course of pattern plating of PCBs, and at high concentrations they interfere with the quality of the plated copper. The chemistry of the electrochemical oxidation of the plating bath contaminants was qualitatively followed using high performance liquid chromatography (HPLC) and chemical oxygen demand (COD) measurements. A complete treatment system is described and rough calculations are given showing, for a given set of conditions, how the proper choice of electrode material and current density can minimize the system cost.

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Authors and Affiliations

  1. Institute for Chemical Process and Environmental Technology, National Research Council of Canada, 1500 Montreal Road, Ottawa, Ontario, K1A 0R6, Canada

    M. Gattrell & B. MacDougall

  2. Industrial Material Institute, National Research Council of Canada, 75 de Mortagne Boulevard, Boucherville, Québec, J4B 6Y4, Canada

    Y.M. Henuset & J. Fournier

Authors
  1. M. Gattrell
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  2. B. MacDougall
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  3. Y.M. Henuset
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  4. J. Fournier
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Gattrell, M., MacDougall, B., Henuset, Y. et al. An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths Part II: Overall system. Journal of Applied Electrochemistry 32, 1303–1311 (2002). https://doi.org/10.1023/A:1022611904516

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  • DOI: https://doi.org/10.1023/A:1022611904516

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