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Simulation of intergranular impedance as a function of diffusion processes

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Abstract

In this paper, the time-temperature dependent intergranular impedance model based on intergranular capacitance model and neck growth kinetics model is defined. The relations between the most dominant electrical parameters of the intergranular micro-capacitance and diffusion equations are established.

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Authors and Affiliations

  1. Faculty of Electronic Engineering, University of Nish, Department of Microelectronics, P.O. Box 73, 18000, Nish, Yugoslavia

    Zoran S. Nikolic

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  1. Zoran S. Nikolic
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Nikolic, Z.S. Simulation of intergranular impedance as a function of diffusion processes. Journal of Materials Science: Materials in Electronics 13, 743–749 (2002). https://doi.org/10.1023/A:1021524730488

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  • DOI: https://doi.org/10.1023/A:1021524730488

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