Abstract
Pb(Zr, Ti)O3 films were prepared on titanium foil using sol–gel processing. The films were of large area, crack-free, uniform, with perovskite structure and exhibiting strong adhesion to the titanium foil substrate. Films and the interface region between the film and the substrate were characterized by X-ray diffraction, X-ray photoelectron spectroscopy, scanning electron microscopy, and dielectric property measurements. The measurements revealed the formation of a TiOx layer at the interface between the film and the foil. The thickness of the TiOx interlayer increases with increasing annealing temperature, and was amorphous when annealed below 600 °C. The dielectric properties of films depend on the thickness of the TiOx interlayer. Films on Ti foil with dielectric constant of 200–400, dielectric loss <5%, leakage current of <1×10−7 A cm−2 at 100 kV cm−1 and breakdown field strength of 0.6–1.13 MV cm−1 were demonstrated. The TiOx interlayer resulted in asymmetric C–V hysterisis behavior attributed to trapped charge in the vicinity of the TiOx interlayer and to elastic mismatch strain.
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References
J. Evans and R. Womack, IEEE J.S.S. Circuits 23 (1988) 1171.
B. Xu, L. E. Cross and J. J. Bernstein, Thin Solid Films 377–378 (2000) 712.
A. B. Wenger, S. R. J. Brueck and A. Y. Wu, Ferroelectrics 116 (1991) 195.
G. S. Wang, X. J. Meng, J. L. Sun, Z. Q. Lai, J. Yu, S. L. Guo, J. G. Cheng, J. Tang and J. H. Chu, Appli. Phys. Lett. 79 (2001) 3476.
J. G. Shin, H. Shin and J. U. Jeon, J. Korean Phys. Soc. 40 (2002) 145.
Y. J. Song, S. Y. Lee, et al., Integr. Ferroelectr. 37 (2001) 377.
Q. Zou, H. Ruda, B. Yacobi and M. Farrell, Thin Solid Films 402 (2002) 65.
G. H. Haertling, Integr. Ferroelectrics 14 (1997) 219.
K. Saegusa, Jpn. J. Appl. Phys. Pt. 36 (1997) 6888.
P. G. Mercado and A. P. Jardine, J. Vac. Sci. Technol. A 13 (1995) 1170.
K. T. Feroz and S. O. Oyadiji, Proc. SPIE 27 (1996) 36.
J. Ishida, T. Yamada, A. Sawabe, K. Okuwada and K. Saito, Appl. Phys. Lett. 80 (2002) 467.
T. Sakoda, K. Aoki and Y. Fukuda, Jpn. J. Appl. Phys. Pt. 1 38 (1999) 3600.
K. D. Budd, S. K. Dey and A. P. Payne, Br. Ceram. Proc. 36 (1985) 107.
Q. Zou, H. Ruda, B. Yacobi and M. Farrell, Appl. Phys Lett. 77 (2000) 1038.
G. R. Bai, I. F. Tsu, A. Wang, C. M. Foster, C. E. Murray and V. P. Dravid, ibid. 72 (1998) 1572.
D. L. Xia, M. D. Liu and Y. K. Zeng, J. Inorg. Matter. 16 (2001) 1549.
K. Maki, N. Soyama, K. Nagamine, S. Mori and K. Ogi, Integr. Ferroelectr. 41 (2001) 167.
K. Miyazawa, A. Obayashi, M. Kuwabara and R. Maeda, Surf. Eng. 17 (2001) 505.
N. Tohge, S. Takahashi and T. Minami, Proc. Am. Ceram. Soc. Symp. 152 (1989) 227.
E. G. Plappert, K. H. Dahmen, R. Hauert and K. H. Ernst, Chem. Vap. Deposit. 5 (1999) 79.
T. M. Shaw, Z. Suo, M. Huang, E. Liniger, R. B. Laibowitz and J. D. Baniecki, Appl. Phys. Lett. 75 (1999) 2129.
W. K. Chim and P. S. Lim, IEEE Trans. Electron. Devices 47 (2000) 473.
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Zou, Q., Ruda, H.E. & Sodhi, R.N. TiOx interlayer characterization for sol–gel derived Pb(Zr, Ti)O3 thin films on titanium foil. Journal of Materials Science: Materials in Electronics 13, 601–604 (2002). https://doi.org/10.1023/A:1020156316175
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DOI: https://doi.org/10.1023/A:1020156316175