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Preparation of insulated metal substrate for MBGA package

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Abstract

An anodizing technique was employed to prepare insulated metal substrates (IMS) for BGA package in this study. The insulating anodic films of aluminum that were chosen as the substrate were studied with different anodizing processes. A multiple-anodizing process improved the characteristics of IMS, including insulating and thermal performances. BGA packages were achieved on the IMS through electroless plating, electroplating, and photolithography methods.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Tsinghua University, Beijing, 100084, People's Republic of China

    Jiman Zhu, Yudong Liu, Liquan Guo & Jusheng Ma

  2. School of Materials Science and Engineering, University of Science and Technology, Beijing, People's Republic of China

    Daobin Mu

Authors
  1. Jiman Zhu
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  2. Yudong Liu
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  3. Liquan Guo
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  4. Jusheng Ma
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  5. Daobin Mu
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Zhu, J., Liu, Y., Guo, L. et al. Preparation of insulated metal substrate for MBGA package. Journal of Materials Science: Materials in Electronics 13, 597–600 (2002). https://doi.org/10.1023/A:1020104332105

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