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Novel approach to deposition of copper thin films by dip-coating method

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Department of Applied Chemistry, Faculty of Engineering, Gifu University, Yanagido 1-1, Gifu, 501-1193, Japan

    Syukri, T. Ban, Y. Ohya & Y. Takahashi

Authors
  1. Syukri
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  2. T. Ban
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  3. Y. Ohya
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  4. Y. Takahashi
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Syukri, Ban, T., Ohya, Y. et al. Novel approach to deposition of copper thin films by dip-coating method. Journal of Materials Science Letters 21, 1449–1451 (2002). https://doi.org/10.1023/A:1019979103071

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  • DOI: https://doi.org/10.1023/A:1019979103071

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