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Application of electron beam lithography to study microcreep deformation and grain boundary sliding

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Abstract

Electron beam lithography has been employed to study microcreep deformation and grain boundary sliding in pure copper. Fine electron-sensitive microgrids of an alloy of palladium and gold were developed on the surface of rectangular specimens. Interrupted creep tests were carried out at 723 K at two stress levels in an argon atmosphere. Creep strain and grain boundary sliding were determined by forming Moire fringes in a scanning electron microscope as well as from the displacement of the grid lines. Local distribution of creep strain inside the grains was found to be non-uniform. Grain boundary sliding exhibited a wavy behaviour.

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Authors and Affiliations

  1. National Research Institute for Metals, 1-2-1, Sengen, Tsukuba Ibaraki, 305, Japan

    S KISHIMOTO & N SHINYA

  2. Indira Gandhi Centre for Atomic Research, Kalpakkam, 603 102, India

    M. D MATHEW

Authors
  1. S KISHIMOTO
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  2. N SHINYA
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  3. M. D MATHEW
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KISHIMOTO, S., SHINYA, N. & MATHEW, M.D. Application of electron beam lithography to study microcreep deformation and grain boundary sliding. Journal of Materials Science 32, 3411–3417 (1997). https://doi.org/10.1023/A:1018668616331

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  • DOI: https://doi.org/10.1023/A:1018668616331

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