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KIM , KS., KIM , JH., LEE , JK. et al. Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature. Journal of Materials Science Letters 16, 1753–1756 (1997). https://doi.org/10.1023/A:1018527525996
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DOI: https://doi.org/10.1023/A:1018527525996