Abstract
The kinetics of electroless silver deposition from solutions containing Co(II)-ammonia complex compounds as reducing agents was studied at 20 and 50 °C. The process rate depends on the solution pH and the concentration of Ag(I), Co(II) and ammonia species. Under optimum operating conditions selected a silver deposition rate up to 1.2 μm h−1 can be obtained at 20 °C with high solution stability. At elevated temperature (50 °C) the rate increases and reaches ∼3 μm h−1. The silver coatings obtained are of high quality, compact and bright.
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Norkus, E., Vaškelis, A., Jagminienė, A. et al. Kinetics of electroless silver deposition using cobalt(II)-ammonia complex compounds as reducing agents. Journal of Applied Electrochemistry 31, 1061–1066 (2001). https://doi.org/10.1023/A:1017983025030
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DOI: https://doi.org/10.1023/A:1017983025030