Skip to main content
SpringerLink
Log in

Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

  • Published:
Journal of Materials Science Letters

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

References

  1. R. R. Tummala, E. J. Rymaszewski and A. G. Klopfenstein, “Microelectronics Packaging Handbook: Semiconductor Packaging, Part II” (Chapman and Hall, New York, 1997) Ch. 8.

    Google Scholar 

  2. M. Abtew and G. Selvaduray, Mater. Sci. & Eng. R. 27 (2000) 95.

    Google Scholar 

  3. W. Yang, R. W. Messler and L. E. Felton, J. Electron. Mater. 23 (1994) 765.

    Google Scholar 

  4. M. McCormack, G. W. Kammlott, H. S. Chen and S. Jin, Appl. Phys. Lett. 65 (1994) 1100.

    Google Scholar 

  5. J. Sigelko, S. Choi, K. N. Subramanian, J. P. Lucas and T. R. Bieler, J. Electron. Mater. 28 (1999) 1184.

    Google Scholar 

  6. W. Yang, L. E. Felton and R. W. Messler Jr., ibid. 24 (1995) 1465.

    Google Scholar 

  7. J. W. Jang, P. G. Kim, K. N. Tu and M. Lee, J. Mater. Res. 14 (1999) 3896.

    Google Scholar 

  8. J. Glazer, Inter. Mater. Rev. 40 (1995) 65.

    Google Scholar 

  9. T. B. Massalski, “Binary Alloy Phase Diagrams” (ASM Interna-tional, Materials Park, OH, 1990).

    Google Scholar 

  10. D. R. Askeland, The Science and Engineering of Materials (PWS Publishing Co., Boston, 1994) Ch. 7.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Motorola, Inc., Tempe, AZ, 85284, USA

    B. Yeung & Jin-Wook Jang

Authors
  1. B. Yeung
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jin-Wook Jang
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Yeung, B., Jang, JW. Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder. Journal of Materials Science Letters 21, 723–726 (2002). https://doi.org/10.1023/A:1015741206911

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1023/A:1015741206911

Keywords

Search

Navigation